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Epoxy Molding Compound (EMC) for Semiconductor Market, Global Outlook and Forecast 2023-2030

The global Epoxy Molding Compound (EMC) for Semiconductor market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period.


The USA market for Global Epoxy Molding Compound (EMC) for Semiconductor market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.



The China market for Global Epoxy Molding Compound (EMC) for Semiconductor market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.


The Europe market for Global Epoxy Molding Compound (EMC) for Semiconductor market is estimated to increase from USD million in 2022 to reach USD million by 2030, at a CAGR during the forecast period of 2023 through 2030.


EMC effectively protects semiconductor circuits from factors in the external environment such as moisture, heat, and shock. Its main ingredients are epoxy resin, hardener, silica, and other additives.

This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound (EMC) for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound (EMC) for Semiconductor. This report contains market size and forecasts of Epoxy Molding Compound (EMC) for Semiconductor in global, including the following market information:


  • Global Epoxy Molding Compound (EMC) for Semiconductor Market Revenue, 2018-2023, 2024-2030, ($ millions)

  • Global Epoxy Molding Compound (EMC) for Semiconductor Market Sales, 2018-2023, 2024-2030, (MT)

  • Global top five Epoxy Molding Compound (EMC) for Semiconductor companies in 2022 (%)

The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.

Standard (Halogen Free) Epoxy Molding Compound Segment to Reach $ Million by 2029, with a % CAGR in next six years.

The global key manufacturers of Epoxy Molding Compound (EMC) for Semiconductor include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI and Eternal Materials, etc. in 2022, the global top five players have a share approximately % in terms of revenue.

We surveyed the Epoxy Molding Compound (EMC) for Semiconductor manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Epoxy Molding Compound (EMC) for Semiconductor Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (MT)

Global Epoxy Molding Compound (EMC) for Semiconductor Market Segment Percentages, by Type, 2022 (%)


  • Standard (Halogen Free) Epoxy Molding Compound

  • Little Warpage Epoxy Molding Compound

  • High Thermal Epoxy Molding Compound

Global Epoxy Molding Compound (EMC) for Semiconductor Market Segment Percentages, by Application, 2022 (%)


  • Lead Frame (DIS and DIP)

  • Substrate (BGA and CSP)

  • Power Devices

Global Epoxy Molding Compound (EMC) for Semiconductor Market Segment Percentages, By Region and Country, 2022 (%)


  • North America (United States, Canada, Mexico)

  • Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)

  • Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)

  • The Middle East and Africa (Middle East, Africa)

  • South and Central America (Brazil, Argentina, Rest of SCA)


The report also provides analysis of leading market participants including:


  • Key companies Epoxy Molding Compound (EMC) for Semiconductor revenues in global market, 2018-2023 (Estimated), ($ millions)

  • Key companies Epoxy Molding Compound (EMC) for Semiconductor revenues share in global market, 2022 (%)

  • Key companies Epoxy Molding Compound (EMC) for Semiconductor sales in global market, 2018-2023 (Estimated), (MT)

  • Key companies Epoxy Molding Compound (EMC) for Semiconductor sales share in global market, 2022 (%)


  • Sumitomo Bakelite

  • Hitachi Chemical

  • Chang Chun Group

  • Hysol Huawei Electronics

  • Panasonic

  • Kyocera

  • KCC

  • Samsung SDI

  • Eternal Materials

  • Jiangsu Zhongpeng New Material

  • Shin-Etsu Chemical

  • Hexion

  • Nepes

  • Tianjin Kaihua Insulating Material

  • HHCK

  • Scienchem

  • Beijing Sino-tech Electronic Material

Chapter 1: Introduces the definition of Epoxy Molding Compound (EMC) for Semiconductor, market overview.

Chapter 2: Global Epoxy Molding Compound (EMC) for Semiconductor market size in revenue and volume.

Chapter 3: Detailed analysis of Epoxy Molding Compound (EMC) for Semiconductor manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: Sales of Epoxy Molding Compound (EMC) for Semiconductor in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Global Epoxy Molding Compound (EMC) for Semiconductor capacity by region & country.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: The main points and conclusions of the report.


Table of content

1 Introduction to Research & Analysis Reports1.1 Epoxy Molding Compound (EMC) for Semiconductor Market Definition1.2 Market Segments1.2.1 Market by Type1.2.2 Market by Application1.3 Global Epoxy Molding Compound (EMC) for Semiconductor Market Overview1.4 Features & Benefits of This Report1.5 Methodology & Sources of Information1.5.1 Research Methodology1.5.2 Research Process1.5.3 Base Year1.5.4 Report Assumptions & Caveats2 Global Epoxy Molding Compound (EMC) for Semiconductor Overall Market Size2.1 Global Epoxy Molding Compound (EMC) for Semiconductor Market Size: 2022 VS 20302.2 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue, Prospects & Forecasts: 2018-20302.3 Global Epoxy Molding Compound (EMC) for Semiconductor Sales: 2018-20303 Company Landscape3.1 Top Epoxy Molding Compound (EMC) for Semiconductor Players in Global Market3.2 Top Global Epoxy Molding Compound (EMC) for Semiconductor Companies Ranked by Revenue3.3 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue by Companies3.4 Global Epoxy Molding Compound (EMC) for Semiconductor Sales by Companies3.5 Global Epoxy Molding Compound (EMC) for Semiconductor Price by Manufacturer (2018-2023)3.6 Top 3 and Top 5 Epoxy Molding Compound (EMC) for Semiconductor Companies in Global Market, by Revenue in 20223.7 Global Manufacturers Epoxy Molding Comp

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